A 595-pin P-PGA (plastic-pin grid array package) was developed for a high-pin-count LSI. The reliability of the 595-pin P-PGA was investigated by means of temperature cycling, and moisture resistance and electromigration tests. The lifetime until 0.1% failure under temperature cycling is determined to be from 2500 to 2700 cycles. There was no failure in moisture resistance and electromigration tests. The electrical characteristics of 595-pin P-PGA were improved for a high-speed operation LSI. As a result, in addition to the fundamental design, a 595-pin P-PGA with eight metal layers was developed, which is suitable for a 50-MHz operation LSI under 3.3-V power supply.
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