A high-density package manufacturing process is briefly described. The role, performance, and application of the electroless nickel and gold plating in the IC package manufacturing process are discussed. The superiority of electroless plating over electrolytic plating is shown. It is concluded that electroless nickel-boron and gold plating for high-density packages provide excellent solderability, corrosion resistance, and electrical performance to meet the requirements of the VLSI fabrication process. Electroless plating is found to be the best choice in multilayer ceramic package manufacturing, especially in high pin (lead) count IC package manufacturing.
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