Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems

摘要

Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite-element/integral-equation method. The mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of frequency dependence of the inductance on pulse propagation is discussed.