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Efficient Reduced-Order Modeling of Frequency-Dependent Coupling Inductances Associated with 3-D Interconnect Structures

机译：与三维互连结构相关的频率耦合电感的高效降阶建模

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Luis Miguel Silveira; Mattan Kamon; Student Member; Jacob White;
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年度 1996
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1. Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures [J] . Miguel Silveira L., Kamon M. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1996,第2期

机译：与3-D互连结构相关的频率相关耦合电感的有效降阶建模
2. Efficient reduced-order modeling of frequency-dependent couplinginductances associated with 3-D interconnect structures [J] . Miguel Silveira L., Kamon M., White J. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1996,第2期

机译：与3-D互连结构相关的频率相关耦合电感的有效降阶建模
3. Efficient reduced-order modeling of frequency-dependent couplinginductances associated with 3-D interconnect structures [J] . Miguel Silveira L., Kamon M., White J. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1996,第2期

机译：与3-D互连结构相关的频率相关耦合电感的有效降阶建模
4. Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures [C] . L. Miguel Silveira, Mattan Kamon, Jacob White ACM/IEEE conference on Design automation . 1995

机译：与3-D互连结构相关的频率相关耦合电感的有效降阶建模
5. Direct numerical investigation and reduced-order modeling of 3-D honeycomb acoustic liners. [D] . Zhang, Qi. 2014

机译：3-D蜂窝声学衬里的直接数值研究和降阶建模。
6. RADICAL SITES IN M. TUBERCULOSIS KATG IDENTIFIED USING EPR SPECTROSCOPY THE 3-D CRYSTAL STRUCTURE AND ELECTRON-TRANSFER COUPLINGS [O] . Kalina Ranguelova, Stefania Girotto, Gary J. Gerfen, -1

机译：利用EPR光谱3-D晶体结构和电子转移耦合鉴定结核分枝杆菌的根系
7. Efficient Reduced-Order Modeling of Frequency-Dependent Coupling Inductances associated with 3-D Interconnect Structures [O] . L. Miguel Silveira, Mattan Kamon, Jacob White, 1995

机译：与3D互连结构相关的频率相关耦合电感的有效降阶建模

Efficient Reduced-Order Modeling of Frequency-Dependent Coupling Inductances Associated with 3-D Interconnect Structures

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