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首页> 外文期刊>IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging >Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures
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Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures

机译:与3-D互连结构相关的频率相关耦合电感的有效降阶建模

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摘要

Reduced-order modeling techniques are now commonly used to efficiently simulate circuits combined with interconnect, but generating reduced-order models from realistic three-dimensional (3-D) structures has received less attention. In this paper, we describe a Krylov-subspace based method for deriving reduced-order models directly from the 3-D magneto-quasistatic analysis program FastHenry. This new approach is no more expensive than computing an impedance matrix at a single frequency.
机译:现在通常使用降阶建模技术来有效地模拟与互连结合的电路,但是从实际的三维(3-D)结构生成降阶模型的关注较少。在本文中,我们描述了一种基于Krylov子空间的方法,可直接从3-D磁准静态分析程序FastHenry导出降阶模型。这种新方法仅比在单个频率下计算阻抗矩阵便宜。

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