System for facilitating planar probe measurements of high-speed interconnect structures

摘要

An adapter (22), having a dielectric substrate (30) upon which are mounted an array of uniformly-spaced, coplanar conductive strips (32) and impedance standards (40,46,48,50) having similarly spaced coplanar leads (44), facilitates planar transmission line probe measurements of the high speed-electrical characteristics of a package or other interconnect structure (10) for a high-speed integrated circuit. The conductive strips (32) of the adapter (22) are connected to the terminals (18) of the package (10) so as to simulate the integrated circuit connection, that is, with substantially identical length and spacing of bond wires (24). The planar probe (26), by contacing the conductive strips (32) of the adapter, is able to measure the electrical characteristics of the package (10) including the bond wires (24), thereby providing realistic measurements of the integrated circuit's environment. The impedance standards (40,46,48,50) on the adapter are specially designed to enable the effects of the adapter to be removed from the measurements by calibration.