首页> 外文会议>International Symposium on Power Semiconductor Devices and ICs >High Voltage Vertical GaN-on-GaN Schottky Barrier Diode with High Energy Fluorine Ion Implantation Based on Space Charge Induced Field Modulation (SCIFM) Effect
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High Voltage Vertical GaN-on-GaN Schottky Barrier Diode with High Energy Fluorine Ion Implantation Based on Space Charge Induced Field Modulation (SCIFM) Effect

机译:基于空间电荷感应场调制(SCIFM)效应的高能氟离子注入高压垂直GaN-on-GaN肖特基势垒二极管

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Electric field crowding at the Schottky edge and Schottky barrier lowering induced leakage current are two major problems that limit the performance of GaN-on-GaN vertical SBD. In this paper, we try to solve these issues. On one hand, a planar edge termination method based on high-energy fluorine ion implantation is explored for high voltage vertical GaN SBD. The space charge induced field modulation effect (SCIFM) is discovered in the ion implanted region. The electrons injected in the implanted region could effectively reduce the surface electric field, alleviating the field crowding at the metal edge. The SBD terminated with high-energy fluorine implanted region presents a breakdown voltage of 1300 V. Utilizing the depletion effect of space charges, the leaky path through the implanted region is partially blocked by the high-energy fluorine ion implanted guard rings. The reverse leakage current of SBD with guard rings is reduced by nearly 3 orders at the reverse bias of 300 V without the deterioration of forward characteristics. On the other hand, the fluorine ion implantation based quasi-JBS structure is investigated to shield the electric field seen by the Schottky contact and reduce the Schottky barrier lowering induced leakage current. The turn-on voltage modulation effect and improved breakdown voltage are observed in the fabricated quasi-JBS diodes, confirming the validity of the SCIFM mechanism in the ion implanted region.
机译:肖特基边缘的电场拥挤和肖特基势垒降低感应漏电流是限制GaN-on-GaN垂直SBD性能的两个主要问题。在本文中,我们尝试解决这些问题。一方面,针对高电压垂直GaN SBD,探索了一种基于高能氟离子注入的平面边缘终止方法。在离子注入区域中发现了空间电荷感应场调制效应(SCIFM)。注入到注入区中的电子可以有效地减小表面电场,从而减轻电场在金属边缘的拥挤。被高能氟注入区终止的SBD的击穿电压为1300V。利用空间电荷的耗尽效应,通过注入区的泄漏路径被高能氟离子注入保护环部分阻止。带保护环的SBD的反向漏电流在300 V的反向偏置下降低了近3个数量级,而不会恶化正向特性。另一方面,研究了基于氟离子注入的准JBS结构,以屏蔽肖特基接触所见的电场并减少肖特基势垒,从而降低了感应漏电流。在所制造的准JBS二极管中观察到了导通电压调制效果和改善的击穿电压,这证实了SCIFM机制在离子注入区域的有效性。

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