Laser-assisted Glass Frit Bonding Combined With Blue Light-shielding

摘要

Laser-assisted glass frit bonding as a noncontact thermal bonding method has been widely applied in the organic light-emitting diodes (OLEDs) encapsulation field. However, blue light emitting from the OLEDs devices could cause many hazards. Therefore, it is of significance to develop a high reliable packaging technology with blue light-shielding performance for OLEDs. In this work, a BiVO4 thin film capable of shielding blue radiation applied in glass frit laser encapsulation were developed. BiVO4 thin films were deposited on glass by chemical solution deposition process. The effect of annealing temperature ranging from 573 to 873K on blue light-blocking performance has been investigated. The optimized BiVO4 films exhibited the best blue light-shielding capability and could block 50.32 % short wavelength blue light (400 - 450 nm), while maintaining greater than 87 % average transmittance in the wavelength range of 500 - 800 nm. Finally, the laser-assisted glass frit bonding device combined with optimized BiVO4 blue light-shielding film has been fabricated. Therefore, transparent BiVO4 film with high blue light-shielding efficiency are desirable for practical encapsulation applications.