Application of laser-assisted glass frit bonding encapsulation in all inorganic quantum dot light emitting devices

摘要

Quantum dot light emitting devices (QLED) were recently investigated as the next generation of displays. Based on the type of transport materials used, the QLEDs are classified as organic, hybrid and inorganic devices. Even though the all-inorganic devices are more stable compared with OLED, the QLED's life still affected by air environment. In this paper, the low-point sealing glass frit as an encapsulation material for all inorganic quantum dot light emitting devices were fabricated by us. It was found that the laser bonding encapsulation had a better barrier performance than UV encapsulation. A lower water vapor transmission rate improved effectively from 5.31 x 10(-2) gm(-2)day(-1) of UV package to 7.46 x 10(-7) gm(-2)day(-1) of the glass frit bonding at 85 degrees C and a relative humidity of 85% and a longer luminance decay time.