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Performance Investigation of Uniaxially Tensile Stressed Ge n-FinFETs Formed on Biaxially Strained GeOI Substrates And Its Impact On Ge CMOS Inverters

机译:在双轴应变GeOI衬底上形成的单轴拉伸应力Ge n-FinFET的性能研究及其对Ge CMOS反相器的影响

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In this work, we studied the performance enhancement of uniaxially tensile stressed n-FinFETs realized on the biaxially strained GeOI (sGOI) wafer and its impact on the performance of a Ge CMOS inverter. Uniaxially strained Ge film with nanoscale film width could be patterned on sGOI substrates and used for the fabrication of strained Ge FinFETs. The performance of this novelly proposed Ge FinFET was compared with the unstrained ones with similar dimensions and fabrication processes. The impact of strain on devices with different geometric parameters are also studied. As the strained FinFETs lead to higher on-current, its impact on the circuit speed was simulated. By comparing the output signal of the strained Ge CMOS inverter with the unstrained one, the former shows obvious speed improvement.
机译:在这项工作中,我们研究了在双轴应变GeOI(sGOI)晶片上实现的单轴拉伸应力n-FinFET的性能增强及其对Ge CMOS反相器性能的影响。可以在sGOI基板上对具有纳米级膜宽的单轴应变Ge膜进行构图,并用于应变Ge FinFET的制造。将这种新颖提出的Ge FinFET的性能与具有相似尺寸和制造工艺的非应变Ge FET进行了比较。还研究了应变对具有不同几何参数的设备的影响。由于应变的FinFET导致较高的导通电流,因此模拟了其对电路速度的影响。通过将应变Ge CMOS反相器的输出信号与未应变Ge CMOS反相器的输出信号进行比较,前者显示出明显的速度提高。

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