Examining the Times for Melting of Different Solder Pastes at the Same Temperature Profile

摘要

The report provides results from the study of the melting times of various solder pastes. Typical of this study is that different couples of pastes are tested at the same temperature profile. Securing such a profile is effected by simultaneous effects on different pastes. For this purpose, a developed hybrid printing method is used. The application of this printing is in Pin in Paste technology (PiP) and components with different thermal mass. Times are given for melting the different pastes using footprints with varying amounts of paste, different topology and different pads. Lead, typical lead-free pastes and lead-free bismuth-based pastes were studied. The experiments were conducted using convective and convectional soldering in air. To determine the melting times, a digital microscope video capture and subsequent scanning treatment was used. The temperature of the process is controlled by a thermocouple.