首页> 外国专利> APPARATUS FOR LEAVING SOLDER PASTE AT ROOM TEMPERATURE BY HOLDING A SOLDER CONTAINER FOR A PREDETERMINED TIME

APPARATUS FOR LEAVING SOLDER PASTE AT ROOM TEMPERATURE BY HOLDING A SOLDER CONTAINER FOR A PREDETERMINED TIME

机译:通过在预定时间内保持焊料容器来在室温下去除焊料糊的装置

摘要

PURPOSE: An apparatus for leaving solder paste at room temperature is provided to automatically lock a solder container inserted in a mounting chamber and release the solder container after a predetermined time.;CONSTITUTION: An apparatus for leaving solder paste at room temperature comprises a solder container(10) receiving solder paste, a main casing(101) having a mounting chamber for mounting the solder container, a locking unit installed in the main casing, and a control unit(171) controlling the locking unit. The locking unit comprises a cam member which presses and fixes the solder container inserted in the mounting chamber to the side wall of the mounting chamber and a motor driving the cam member.;COPYRIGHT KIPO 2013
机译:目的:提供一种在室温下放置焊膏的装置,以自动锁定插入到安装室中的焊料容器,并在预定时间后释放焊料容器。;构成:一种在室温下放置焊膏的装置包括一个焊料容器(10)接收焊膏,具有用于安装焊料容器的安装室的主壳体(101),安装在主壳体中的锁定单元以及控制该锁定单元的控制单元(171)。锁定单元包括:凸轮构件,其将插入在安装腔室中的焊料容器压紧并固定到安装腔室的侧壁;以及驱动凸轮构件的马达。COPYRIGHTKIPO 2013

著录项

  • 公开/公告号KR101186380B1

    专利类型

  • 公开/公告日2012-09-26

    原文格式PDF

  • 申请/专利权人 CHO MYOUNG HEE;

    申请/专利号KR20120045269

  • 申请日2012-04-30

  • 分类号B23K3/08;H05K3/34;

  • 国家 KR

  • 入库时间 2022-08-21 17:07:27

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