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APPARATUS FOR LEAVING SOLDER PASTE AT ROOM TEMPERATURE BY HOLDING A SOLDER CONTAINER FOR A PREDETERMINED TIME
APPARATUS FOR LEAVING SOLDER PASTE AT ROOM TEMPERATURE BY HOLDING A SOLDER CONTAINER FOR A PREDETERMINED TIME
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机译:通过在预定时间内保持焊料容器来在室温下去除焊料糊的装置
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摘要
PURPOSE: An apparatus for leaving solder paste at room temperature is provided to automatically lock a solder container inserted in a mounting chamber and release the solder container after a predetermined time.;CONSTITUTION: An apparatus for leaving solder paste at room temperature comprises a solder container(10) receiving solder paste, a main casing(101) having a mounting chamber for mounting the solder container, a locking unit installed in the main casing, and a control unit(171) controlling the locking unit. The locking unit comprises a cam member which presses and fixes the solder container inserted in the mounting chamber to the side wall of the mounting chamber and a motor driving the cam member.;COPYRIGHT KIPO 2013
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