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Measurement of Re-Melting Temperature of Low Melting Temperature Reaction Layer between SnPb Plating and Lead-Free Solder

机译：在SNPB电镀和无铅焊料之间测量低熔点温度反应层的重新熔化温度

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Naoki YAMA; Kiyotaka UCHIDA; Eriko UEDA;
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年度 2005
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1. Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy [J] . Yulai Gao, Changdong Zou, Bin Yang Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2009,第1a2期

机译：SnAgCu无铅焊料合金的纳米粒子，具有与SnPb焊料合金等效的熔化温度
2. Development of new no-flow underfill materials for both eutectic Sn-Pb solder and a high temperature melting lead-free solder [J] . Haiying Li, Johnson A., Wong C.P. IEEE Transactions on Components and Packaging Technologies . 2003,第2期

机译：开发用于共晶Sn-Pb焊料和高温熔融无铅焊料的新型无流动底部填充材料
3. Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions [J] . Sang-Min Lee, Jeong-Won Yoon, Seung-Boo Jung Journal of materials science . 2015,第3期

机译：低熔点Sn-58Bi焊料与回流反应过程中各种表面处理之间的界面反应和机械性能
4. Development of new no-flow underfill materials for both eutectic solder and a high temperature melting lead-free solder [C] . Haiying Li, Wong, C.P. Electronic Components and Technology Conference, 2001. Proceedings., 51st . 2001

机译：开发用于共晶焊料和高温熔融无铅焊料的新型无流动底部填充材料
5. A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls [D] . Kannammal Palaniappan, Sakthi Cibi. 2016

机译：低温SNBI焊膏的工艺，强度和微观结构分析混合无铅焊球
6. Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging [O] . Chunjin Hang, Junjian He, Zhihao Zhang, -1

机译：通过将Sn3.5Ag焊料渗透到多孔Ag片中进行低温粘结以用于功率器件包装中的高温芯片附着
7. Spreading of Copper Phosphorus Brazing Filler Metals with Low Melting Temperature containing silver and/or Tin : Copper Phosphorus Brazing Filler Metals with Low Melting Temperature (Report IV)(Physics, Process, Instrument Measurement) [O] . TAKEMOTO Tadashi, OKAMOTO Ikuo, MATSUMURA Junji 2013

机译：含银和/或锡的低熔点铜磷钎料的传播：熔点低铜磷钎料（报告IV）（物理，工艺，仪器与测量）

Measurement of Re-Melting Temperature of Low Melting Temperature Reaction Layer between SnPb Plating and Lead-Free Solder

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