Plasma Dicing 300mm Framed Wafers — Analysis of Improvement in Die Strength and Cost Benefits for Thin Die Singulation

摘要

Plasma Dicing uses Deep Reactive Ion Etch (DRIE), also known as The Bosch Process. This is a well-established "front-end" technology, used in silicon MEMS micromachining and via etching in 3D packaging, which is now finding a new home as a dicing technology in the "back-end" of semiconductor processing. This paper will discuss the key issues and integration challenges. This is not only in wafer design and preparation, but also how the process flow is not disrupted to the extent where it becomes a hindrance to the adoption of a technology that offers so many potential benefits.