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SRAM stability analysis for different cache configurations due to Bias Temperature Instability and Hot Carrier Injection

机译:由于偏置温度不稳定和热载流子注入,对不同缓存配置的SRAM稳定性分析

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Bias Temperature Instability (BTI) and Hot Carrier Injections (HCI) are two of the main effects that increase a transistor's threshold voltage and further cause performance degradations. These two wearout mechanisms affect all transistors, but are especially acute in the SRAM cells of first-level (L1) caches, which are frequently accessed and are critical for microprocessor performance. This work studies the cache lifetimes due to the combined effect of BTI and HCI for different cache configurations, including variation in cache size, associativity, cache line size, and the replacement algorithm. The effect of process variations is also considered. We analyze the reliability (failure probability) and performance (hit rate) of the L1 cache within a LEON3 microprocessor, while the LEON3 is running a set of benchmarks, and we provide essential insights on performance-reliability tradeoffs for cache designers.
机译:偏置温度不稳定性(BTI)和热载流子注入(HCI)是增加晶体管阈值电压并进一步导致性能下降的两个主要影响。这两种磨损机制会影响所有晶体管,但在一级(L1)高速缓存的SRAM单元中尤为严重,这是经常访问的且对于微处理器性能至关重要。这项工作研究了BTI和HCI对不同缓存配置的综合影响所导致的缓存寿命,包括缓存大小,关联性,缓存行大小和替换算法的变化。还考虑了工艺变化的影响。我们在LEON3运行一组基准的同时,分析了LEON3微处理器中L1高速缓存中L1高速缓存的可靠性(失败概率)和性能(命中率),并为高速缓存设计人员提供了有关性能可靠性折衷的基本见解。

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