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A 1200 V-class Fin P-body IGBT with ultra-narrow-mesas for low conduction loss

机译:具有超窄边框的1200 V级Fin P体IGBT,可降低传导损耗

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In this paper, a new 1200 V-class ultra-narrow-mesas fin p-body IGBT (U-Fin-P IGBT) is proposed. Different from the previously demonstrated fin p-body IGBT, a much narrower fin (mesa) width (~0.5 μm) is adopted in the U-Fin-P IGBT to further reduce the conduction loss; whereas the difficulty of doing emitter contact lithography on top of the ultranarrow mesa regions is resolved by using a self-aligned contact formation process design. It is found from numerical simulations that for the same turn-off energy loss, the on-state voltage drop Von (at 150°C) of the U-Fin-P IGBT is ~21% lower than that of the fin p-body IGBT. Furthermore, the U-Fin-P IGBT also shows excellent turn-on dVldt controllability.
机译:本文提出了一种新型的1200 V级超窄边框鳍状p体IGBT(U-Fin-P IGBT)。与先前展示的鳍片p体IGBT不同,U-Fin-P IGBT采用了更窄的鳍片(mesa)宽度(〜0.5μm),以进一步降低传导损耗。而通过使用自对准接触形成工艺设计解决了在超窄台面区域顶部进行发射极接触光刻的困难。从数值模拟中发现,对于相同的关断能量损耗,U-Fin-P IGBT的导通状态压降Von(在150°C时)比fin p-body低约21%。 IGBT。此外,U-Fin-P IGBT还显示出出色的导通dVldt可控性。

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