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Ultra-Fast 1200 V IGBTs Reduce Switching and Conduction Losses

机译:超快速1200 V IGBT减少开关和传导损耗

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摘要

Anew family of 1200V IGBTs has been optimized for lowest switching losses and smoothest turn-off in higher frequency and motor control applications. This paper will explain new approaches such as the Solderable Front Metal (SFM] technology, which greatly extends power cycling capability, while dual-sided cooling further reduces power dissipation to provide a highly efficient solution, i By utilizing field stop thin wafer technology, a new generation of 1200V IGBTs are capable of achieving typical voltage drop (Yce(on)) as low as 1.7V and typical fall time of less than 100 nsec at their nominal current ratings.
机译:新的1200V IGBT系列已经过优化,可在较高频率和电机控制应用中实现最低的开关损耗和最平稳的关断。本文将介绍新方法,例如可焊前金属(SFM)技术,该技术可大大扩展功率循环能力,而双面冷却可进一步降低功耗,从而提供高效解决方案。新一代1200V IGBT在其标称额定电流下能够实现低至1.7V的典型压降(Yce(on))和小于100 ns的典型下降时间。

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