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Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method

机译:热蒸发法沉积PbTe薄膜的结构和热电性能

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Lead telluride (PbTe) thin films have been deposited on SiO2 substrate using thermal evaporation method. The structure of the films was found to have a face-centered cubic (fcc) with predominant grain growth in the (200) direction for both as-deposited and annealed samples up to 350 °C in vacuum for 1 h. The in-plain electrical resistivity and Hall measurements via van der Pauw method as a function of annealed temperatures were measured. It was found that increasing the annealing temperature led to increase in grain size, which in turn caused decrease of electrical resistivity and increase of Seebeck coefficient. The high power factor of 141.0 μWm-1K-2 was obtained for the annealed samples at 350 °C in vacuum for 1 h.
机译:碲化铅(PbTe)薄膜已使用热蒸发法沉积在SiO2衬底上。发现薄膜的结构具有一个面心立方(fcc),在真空中放置和退火的样品在350°C下保持1 h时,晶粒的主要生长方向是(200)方向。测量了通过范德堡方法进行的平面内电阻率和霍尔测量值与退火温度的函数关系。发现增加退火温度导致晶粒尺寸增加,这又导致电阻率降低和塞贝克系数的增加。在350℃,真空1 h的条件下,对退火后的样品获得了141.0μWm-1K-2的高功率因数。

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