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Complexity of the total dose radiation response of fully depleted silicon-on-insulator NMOSFETs

机译:完全耗尽的绝缘体上硅NMOSFET的总剂量辐射响应的复杂性

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With bias conditions changed during irradiation, the bias dependence of the total dose radiation response of fully depleted (FD) silicon-on-insulator (SOI) n-channel MOS transistors (NMOSFETs) is investigated preliminarily. It is found that the threshold voltage shift of the FD SOI NMOSFETs as a function of total dose exhibits an abrupt inverse change, namely, a unexpected rapid reduction, with increasing total dose, when the bias condition is changed from OFF-state into transmission gate (TG). It is also found that it is not always effective to reduce the total dose sensitivity of the tested transistors by applying a negative voltage to their back gates during irradiation. In addition, the rebound of the threshold voltage shift has been observed clearly with dose for the transistors biased using both the OFF-state and the TG during irradiation, which can be partly attributed to the radiation induced electron traps located at the interface between the silicon film and buried oxide (BOX).
机译:在照射过程中改变偏压条件的情况下,初步研究了完全耗尽(FD)绝缘体上硅(SOI)n沟道MOS晶体管(NMOSFET)的总剂量辐射响应的偏压依赖性。发现当偏置条件从关断状态变为传输门时,FD SOI NMOSFET的阈值电压偏移随总剂量的变化呈现出突然的逆变化,即,随着总剂量的增加,出现了意想不到的快速降低。 (TG)。还发现通过在辐照期间向它们的背栅施加负电压来降低被测晶体管的总剂量敏感性并非总是有效的。此外,通过在辐照期间同时使用OFF和TG偏置的晶体管剂量,可以清楚地观察到阈值电压偏移的反弹,这可以部分归因于位于硅之间界面的辐射感应电子陷阱。膜和掩埋氧化物(BOX)。

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