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A double trench 4H — SiC MOSFET as an enhanced model of SiC UMOSFET

机译:双沟4h - SiC MOSFET作为SIC UMOSFET的增强型号

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In this paper, a double trench 4H SiC MOSFET is presented as an enhanced model for the SiC conventional UMOSFET with a p+ shielding to prevent dielectric breakdown of the gate oxide. This paper proposes a double trench structure with both gate and source trenches. The double trench structure reduces the electric field at the bottom of the gate oxide. Thus, on optimizing the model of UMOSFET with Double Trench structure we further increase the breakdown voltage (BV). Hence, higher BV is achieved compared to conventional SiC UMOSFET, resulting in increase of overall figure of merit (FoM) to an appreciable value. The BV achieved is 1450 V and ON-state specific resistance (RON-sp) is 4.24 mΩ.cm2which on calculation gives FoM to be 0.495. Thus, the FoM is improved by 36.3% compared to conventional SiC UMOSFET.
机译:在本文中,双沟槽4H SiC MOSFET作为具有P +屏蔽的SiC传统UMOSFET的增强型模型,以防止栅极氧化物的介电击穿。本文提出了具有双沟槽结构的双沟和源沟槽。双沟槽结构减少了栅极氧化物底部的电场。因此,在用双沟槽结构优化UMOSFET模型,我们进一步增加了击穿电压(BV)。因此,与传统的SiC UMOSFET相比,实现了更高的BV,从而增加了优选(FOM)的总体图形到明显值。实现的BV是1450 V和导通状态的电阻(R On-SP )是4.24mΩ.cm 2 这在计算上给出了0.495的FOM。因此,与传统的SiC UMOSFET相比,FOM通过36.3×%提高了36.3%。

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