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Impact of p-GaN Gate Length on Performance of AlGaN/GaN Normally-off HEMT Devices

机译:P-GAN栅极长度对ALGAN / GAN常压HEMT器件性能的影响

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In this work, we have studied the effect of variation in length of GaN gate with p-type doping concentration on the DC performances of AlGaN/GaN normally-off HEMT using 2D Atlas TCAD simulator. A comprehensive simulation is undertaken on the proposed device to examine different performance parameters such as drain current, transconductance factor, energy band diagram, and surface potential with respect to change in p-type GaN gate lengths. The gate lengths are varied from 60 to 90 nm, and it is noticed from the simulation results that with a decrease in gate length the drain current increases and transconductance increases. A proper optimization of gate length is indispensable to preserve the normally-off mode operation and at the same time enhancing certain performance parameters.
机译:在这项工作中,我们研究了使用2D ATLAS TCAD模拟器的AlGaN / GaN的DC性能对P型掺杂浓度的GaN型掺杂浓度的变化效果。在所提出的装置上进行了全面的模拟,以检查不同的性能参数,例如漏电流,跨导因子,能带图和表面电位相对于p型GaN栅极长度的变化。栅极长度在60到90nm中变化,从模拟结果中被注意到,漏极电流增加和跨导增加的栅极长度的降低。栅极长度的正确优化是不可或缺的,以保持常关模式操作,同时增强某些性能参数。

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