Dynamic response of a molded leaded package in wire bonding assembly process

摘要

In this paper, a 3-D finite element (FE) model was established to simulate the dynamic vibration in lead frame of molded leaded package (MLP during wire bonding process. The dynamic vibration response in the MLP will be examined. Four lead frame design options are investigated for their dynamic response during the wire bonding process. Two different wire bonding ultrasonic vibration directions are studied. Different wire bonding clamping methods are considered. Different polymer tape materials under lead frame are checked as well. Finally, the ball stitch on ball (BSOB) wire bonding and normal wire bonding process are compared. The FEA modeling results show that all of these factors have impacted on the neighbor leads' vibration response significantly. BSOB wire bonding method is a good method to reduce neighbor lead vibration for all four lead frame design options. This study helps to improve assembly yield in wire bonding process of a lead frame MLP.