Influence of different methods of ageing on microstructure of solder joints

机译：不同时效方法对焊点组织的影响

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An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.

机译：研究了阻尼热和热循环对焊点组织和显微硬度的影响。焊点是通过气相和热空气回流焊制备的。显微组织分析的结果表明，时效对大量焊点中的空隙和裂纹的传播具有显着影响。

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《International Spring Seminar on Electronics Technology》|2014年|202-205|共4页
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Pietrikova A.; Durisin J.; Bazu M.; Ilian V.;
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关键词
Aging; DH-HEMTs; Heating; Joints; Merging; Microstructure; Soldering;

机译：老化; DH-HEMT;加热;关节;合并;微观结构焊接;

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专利

1. 两种不同方法制备的IN939高温合金在长时间时效过程中的组织稳定性的比较 [J] . M. R. JAHANGIRI, H. ARABI, S. M. A. BOUTORABI 中国有色金属学报（英文版） . 2014,第006期
2. Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder [J] . Guoqian Mu, Wenqing Qu, Xixiao Lv, MATEC Web of Conferences . 2019,第2期

机译：热时效对锡基焊料金合金接头组织和性能的影响
3. Influence of the fluxes properties on quality and the microstructure of lead-free solder joints executed by selective soldering [J] . Marek Koscielski, Janusz Sitek Soldering & Surface Mount Technology . 2014,第1期

机译：助焊剂性能对选择性焊接无铅焊点质量和微观结构的影响
4. Microstructure, mechanical properties and corrosion analysis of Sn-0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method [J] . Puskaraj D. Sonawwanay, V. K. Bupesh Raja, M. A. A. Mohd Salleh, Journal of materials science . 2021,第16期

机译：SN-0.7CU + GA焊点采用绿色浓缩太阳能焊接法开发的微观结构，力学性能和腐蚀分析
5. Influence of different methods of ageing on microstructure of solder joints [C] . Pietrikova A., Durisin J., Bazu M., International Spring Seminar on Electronics Technology . 2014

机译：不同方法对焊点微观结构的影响
6. Influence of cryogenic temperature and microstructure on fatigue failure of indium solder joint [D] . Chang, Rui Wu 2008

机译：低温温度和显微组织对铟锡焊点疲劳失效的影响
7. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响
8. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas Atieh, Tala Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响

Influence of different methods of ageing on microstructure of solder joints

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