Microstructure, mechanical properties and corrosion analysis of Sn-0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method

摘要

Concentrated Solar Energy Soldering (CSES) technique is applied for soldering newly developed Gallium added Sn-0.7Cu Lead-Free solder and evaluated with CSI (Conventional Soldering Iron) solder joints. Tensile strength, bending/ flexural strength, microhardness, optical microstructures, SEM microstructures and EDS analysis were utilized to relate CSES solder joints with CSI solder joints. Salt spray test (SST) was employed for corrosion analysis of CSES and CSI solder joints. Experimental findings disclose that the tensile response, bending strength and microhardness of the CSES solder joints were very nearly identical to that of the CSI solder joints. It was witnessed that post-corrosion, the tensile strength, bending strength and microhardness for CSES and CSI solder joints lowered. Further, with Gallium add-on, microstructure and mechanical properties enhanced. The results establish CSES technique as a green technology and a prospective alternative to CSI method.