首页> 外文期刊>Advances in materials science and engineering >Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method
【24h】

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

机译:使用新型浓缩太阳能焊接(CSES)法(CSES)法(CSES)法

获取原文
           

摘要

In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional Soldering Iron) solder joints. Tensile strength, bending/flexural strength, microhardness, electrical resistivity, fractography, optical microstructures, SEM microstructures, and EDS analysis were used to compare CSES solder joints with CSI solder joints. The salt spray test (SST) was used for corrosion analysis of CSES and CSI solder joints. Experimental results reveal that the tensile response, bending strength, and microhardness of the CSES solder joints were almost equal to those of the CSI solder joints. It was observed that after corrosion, the tensile strength, bending strength, and microhardness for CSES and CSI solder joints reduced. CSES solder joints were found to be slightly better than CSI solder joints for electrical resistivity. Electrical resistivity for all the cases studied was found to increase slightly after corrosion. Interfacial integrity and effect of corrosion were clearly observed on CSES and CSI solder joint microstructures. The intermetallic compounds (IMC) formed in case of CSES solder joints were found to be having slightly less thickness than that of CSI solder joints. The results demonstrate CSES technique as a green technology and a potential substitute to the CSI method.
机译:在这项研究中,“集中的太阳能(CSE)”用于焊接并被命名为“集中的太阳能焊接(CSES)技术”。无铅焊料用于比较新的CSE技术焊点与CSI(常规烙铁)焊点。抗拉强度,弯曲/弯曲强度,微硬度,电阻率,断裂,光学微观结构,SEM微观结构和EDS分析用于将CSE焊点与CSI焊点进行比较。盐雾试验(SST)用于CSE和CSI焊点的腐蚀分析。实验结果表明,CSE焊点的拉伸响应,弯曲强度和显微硬化几乎等于CSI焊点的焊点。观察到,在腐蚀后,CSE和CSI焊点的拉伸强度,弯曲强度和显微硬度降低。发现CSES焊点比用于电阻率的CSI焊点略好。在腐蚀后发现所有研究案件的电阻率略微增加。 CSE和CSI焊点微结构清楚地观察到界面完整性和腐蚀的效果。在CSES焊点中形成的金属间化合物(IMC)被发现厚度略低于CSI焊点的厚度。结果证明了CSES技术作为绿色技术和潜在的替代CSI方法。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号