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New evaluation method for reliability of poly-Si thin film transistors using pico-second time-resolved emission microscope

机译:使用微微第二秒分辨发射显微镜的多Si薄膜晶体管可靠性的新评价方法

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摘要

We have analyzed degradation of n-ch TFT under dynamic stress using pico-second time-resolved emission microscope. We have successfully detected emission in pulse fall edge for the first time. We have also obtained a hot electron current during the pulse fall using a device simulation that took the transient effect into consideration. Based on the reasonable agreement between the experimental emission intensity and the theoretical current, we proposed a new degradation model.
机译:使用微微第二秒分辨发射显微镜,我们在动态应力下分析了N-CH TFT的降解。我们首次成功地检测到脉冲坠落边缘的发射。我们还使用瞬态效应考虑到脉冲落下期间的热电子电流。基于实验发射强度与理论电流之间的合理协议,我们提出了一种新的退化模型。

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