CMOS integrated circuits; adhesives; biosensors; chip scale packaging; curing; encapsulation; microfabrication; microfluidics; silicones; CMOS biosensor chip; CMOS substrate film; Dow Corning 3140 silicone-based adhesive; ITO; ITO glass lid material; Si; SiN; SiN substrate material; biocompatibility; bond strength; critical dimension; encapsulation; integrated electronic packaging; maskless approach; microfluidic channel fabrication; microfluidic dam structures; microfluidic packaging; minimum microfluidic dam height; test vehicles; thermal curing epoxy; ultraviolet curable epoxy; ultraviolet curing acrylate adhesive; Biosensors; Bonding; Glass; Indium tin oxide; Microfluidics; Needles; Packaging;
机译:微流体芯片集成电子生物传感器的最新进展,用于多路复用检测
机译:具有过渡补偿的陶瓷集成无源器件上的倒装芯片组装的带CMOS芯片模块,用于毫米波封装系统集成
机译:用于芯片实验室应用的高密度CMOS电极阵列的微流体封装
机译:CMOS生物传感器芯片集成电子和微流体包装
机译:CMOS后电化学微传感器制造和封装,用于CMOS电化学生物传感器阵列。
机译:带有弹性微流体的固态集成电路芯片的软包装
机译:具有弹性体微流体的固态集成电路芯片的灵活包装