X-ray chemical analysis; acoustic microscopy; design of experiments; failure analysis; gold; indium; reliability; scanning electron microscopy; solders; tape automated bonding; Au-In; DOE; EDX; X-ray scanning; bonded structure; cross-sectional SEM; deposited multilayer composite; deposited thin composites; design of experiment; energy dispersive X-ray spectroscopy; failure mode; fluxless eutectic bonding; heterogeneous silicon microcooler stacking; heterogeneous structure; nearly void-free bonds; preclean process steps; scanning acoustic microscope analysis; scanning electron microscope; shear test; solder joint reliability; thermal compression bonding process conditions; thermal cycling test; Bonding; Gold; Heating; Silicon; Substrates;
机译:通过直接氧化物粘接和通孔 - 最后3-D互连通过直接氧化物粘接和通过最后3-D互连的非均相集成
机译:基于铜晶圆键合的硅层堆叠工艺开发和键合质量研究
机译:使用铟银多层复合材料的无助焊剂技术
机译:使用沉积的金铟多层复合材料进行无流动粘合的开发,用于异质硅微冷却器堆叠
机译:加工-环境耐用的碳化硅/碳化硅复合材料的化学气相沉积氧化锆纤维涂层的微观结构关系。
机译:使用Al2O3势垒层控制原子层沉积的Al2O3 / La2O3 / Al2O3栅堆叠中的硅扩散控制
机译:使用电镀共晶Au / Sn / Au结构将大硅芯片无助焊剂粘结到陶瓷封装上
机译:选用HfO2-硅和稀土硅基粘结涂层及siC / siC陶瓷基复合材料环境阻隔涂层体系的开发与性能评价。