Thermal-Power Delivery Network Co-Analysis for Multi-Die Integration

摘要

In this paper, we present a thermal-power delivery network (PDN) co-analysis framework to analyze various multi-die integration schemes. In the proposed approach, we capture the interdependencies between temperature distribution of the dice in a package and the supply voltage noise. We use standalone thermal and PDN analyses as references to compare our co-analysis results. Using a multi-die package and a bridge-based 2.5-D package case studies, our analysis shows a 10-12% overestimation in steady-state temperature and power supply noise.