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Study of Total Ionizing Dose Effects in 65nm Digital Circuits with the DRAD Digital RADiation Test Chip

机译:65nm数字电路与死亡数字辐射测试芯片总电离剂量效应的研究

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Radiation damage to electronic components is one of the main concerns for LHC (Large Hadron Collider) on-detector ASIC design engineers. Studies are needed in order to achieve the radiation hardness required by the chips used in key sub-detectors of ATLAS and CMS upgrades. A Digital RADiation (DRAD) test chip has been specifically designed to study the impact of Total Ionizing Dose (TID) on digital logic gates in a 65nm CMOS technology. Nine different versions of standard cell libraries are studied in this chip, basically differing in the device dimensions, Vt flavor and layout of the device. Each library has eighteen test structures specifically designed to characterize delay degradation and power consumption of the standard cells. They are based on delay chains and ring oscillators with different gates, as well as specific test structures for the measurement of hold and setup time of sequential elements. Specific high speed structures (VCO and counters) are included for future high speed optical links chips. The test structures have been optimized and verified using 200 and 500 Mrad transistor models from the radiation working group of the RD53 collaboration. A test system has been developed for the DRAD chip to enable radiation tests to be performed in X-ray facilities. Results up to 1Grad under different conditions (temperature, bias and annealing) are reported.
机译:对电子元件的辐射损坏是LHC(大型HADRON COLLICRER)ON探测器ASIC设计工程师的主要问题之一。需要研究,以实现在ATLAS和CMS升级的关键子探测器中使用的芯片所需的辐射硬度。数字辐射(DRAD)测试芯片专门设计用于研究总电离剂量(TID)对65nm CMOS技术的数字逻辑门的影响。在该芯片中研究了九种不同版本的标准单元库,在设备尺寸,VT风味和设备布局中基本上不同。每个库具有18个测试结构,专门设计用于表征标准单元的延迟降级和功耗。它们基于具有不同门的延迟链和环形振荡器,以及用于测量顺序元素的保持和设置时间的特定测试结构。未来的高速光学链路芯片包括特定的高速结构(VCO和计数器)。使用来自RD53协作的辐射工作组的200和500Mrad晶体管模型进行了优化和验证了测试结构。已经为DRAD芯片开发了测试系统,以使辐射测试能够在X射线设施中进行。结果在不同条件下(温度,偏差和退火)在不同条件下达到1Grad。

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