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Study of Total Ionizing Dose Effects in 65nm Digital Circuits with the DRAD Digital RADiation Test Chip

机译:使用DEAD数字辐射测试芯片研究65nm数字电路中的总电离剂量效应

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Radiation damage to electronic components is one of the main concerns for LHC (Large Hadron Collider) on-detector ASIC design engineers. Studies are needed in order to achieve the radiation hardness required by the chips used in key sub-detectors of ATLAS and CMS upgrades. A Digital RADiation (DRAD) test chip has been specifically designed to study the impact of Total Ionizing Dose (TID) on digital logic gates in a 65nm CMOS technology. Nine different versions of standard cell libraries are studied in this chip, basically differing in the device dimensions, Vt flavor and layout of the device. Each library has eighteen test structures specifically designed to characterize delay degradation and power consumption of the standard cells. They are based on delay chains and ring oscillators with different gates, as well as specific test structures for the measurement of hold and setup time of sequential elements. Specific high speed structures (VCO and counters) are included for future high speed optical links chips. The test structures have been optimized and verified using 200 and 500 Mrad transistor models from the radiation working group of the RD53 collaboration. A test system has been developed for the DRAD chip to enable radiation tests to be performed in X-ray facilities. Results up to 1Grad under different conditions (temperature, bias and annealing) are reported.
机译:电子元件的辐射损坏是LHC(大型强子对撞机)探测器ASIC设计工程师关注的主要问题之一。为了达到ATLAS和CMS升级的主要子探测器中使用的芯片所需的辐射硬度,需要进行研究。专门设计了一种数字辐射(DRAD)测试芯片,以研究65nm CMOS技术中总电离剂量(TID)对数字逻辑门的影响。在该芯片中研究了九种不同版本的标准单元库,它们在设备尺寸,Vt风味和设备布局上基本上有所不同。每个库都有18个测试结构,这些结构专门设计用于表征标准单元的延迟降级和功耗。它们基于具有不同门的延迟链和环形振荡器,以及用于测量顺序元件的保持和建立时间的特定测试结构。特定的高速结构(VCO和计数器)包括在将来的高速光链路芯片中。 RD53合作的辐射工作组使用200和500 Mrad晶体管模型对测试结构进行了优化和验证。已经为DRAD芯片开发了一种测试系统,可以在X射线设备中进行辐射测试。报告了在不同条件(温度,偏置和退火)下达到1Grad的结果。

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