In power assemblies, heat transfer due to the die self-heating is one of the most important point on time life assemblies. Heat has to be evacuated toward the base-plate not to weaken the solder joint under the die. Double-sided assemblies are attractive for heat transfer and many studies were initiated to have better heat transfer. So, we can observe less density energy deformation (DED) in solder joints and more stresses in the die. The purpose of this paper is to quantify the part of DED in the joint compared to the stresses in the die and finally to see the best configuration between single or double face assemblies.
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