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Avalanche Capability Characterization of 1.2 kV SiC Power MOSFETs Compared with 900V Si CoolMOS

机译:雪崩功能表征1.2 kV SIC电源MOSFET与900V SI Coolmos相比

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The failure mode and operation robustness under extreme condition are critical factors to maximize the potential of SiC MOSFET for high power energy conversion application. In this paper, the avalanche performances of commercial 1.2 kV SiC MOSFET and 900 V Si CoolMOS are characterized and evaluated by signal-pulse unclamped inductive switching (UIS) circuits. The two key parameters related about avalanche capability are calculated to evaluate avalanche capability, including the maximum avalanche current and maximum avalanche energy. Furthermore, the power device models based on physical structure are established by TCAD simulation software. Different mechanisms of avalanche failure are found. The avalanche failure for SiC MOSFET is caused by the parasitic BJT turn-on mechanism, and the avalanche failure for Si CoolMOS is caused by the large avalanche current under gate oxide bottom. The characterization results combined with simulation indicate that the avalanche capability of SiC MOSFET is much better than Si CoolMOS for the larger maximum avalanche current and energy.
机译:在极端条件下的故障模式和操作稳健性是最大化SiC MOSFET的潜力,用于高功率能量转换应用的关键因素。本文通过信号脉冲未扫描电感切换(UIS)电路,表征和评估了商业1.2kV SiC MOSFET和900V SI CoolMOS的雪崩性能。计算有关雪崩功能相关的两个关键参数以评估雪崩功能,包括最大雪崩电流和最大雪崩能量。此外,基于物理结构的功率器件模型由TCAD仿真软件建立。发现了雪崩失败的不同机制。 SiC MOSFET的雪崩故障是由寄生BJT导通机构引起的,并且Si Coolmos的雪崩失败是由栅极氧化物底部的大型雪崩电流引起的。表征结果与仿真相结合,表明SiC MOSFET的雪崩能力远比Si Coolmos更好,用于较大的最大雪崩电流和能量。

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