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Diffusion Furnace Dopant Activation Matching Through a Ramped Temperature Idle

机译:扩散炉掺杂剂激活通过坡道怠速匹配

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Significant non-uniform 'time at temperature' or Dt variation is observed across a horizontal furnace load in diffusion batch processes. Non uniform activation of dopants is observed in 800°C, short duration processes with high mobility dopant species. Dt matching across the furnace is obtained by changing the temperature zone set points at furnace idle prior to pushing and processing a full wafer batch. A ramped idle temperature ranging 120°C across the furnace improves activation uniformity. Boron implanted test wafers show an 85% reduction in activation non uniformity' across the furnace when using a ramped idle.
机译:在扩散批处理过程中,在水平炉负荷上观察到温度'或DT变化的显着不均匀的“时间”。在800℃下观察到掺杂剂的不均匀活化,具有高迁移率掺杂剂物种的短持续时间。通过在推动和处理完整的晶片批次之前通过改变炉子怠速时的温度区设定点来获得炉子的DT匹配。旋转怠速温度范围为120°C,可提高激活均匀性。硼植入的试验晶片显示使用斜坡怠速时炉中的活化非均匀性的85%降低。

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