首页> 外文会议>41st European Solid-State Device Research Conference >Understanding device performance by incorporating 2D-carrier profiles from high resolution scanning spreading resistance microscopy into device simulations
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Understanding device performance by incorporating 2D-carrier profiles from high resolution scanning spreading resistance microscopy into device simulations

机译:通过将高分辨率扫描扩展电阻显微镜中的2D载流子剖面图纳入器件仿真来了解器件性能

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We developed a procedure and software allowing us to predict and understand device performance by incorporating 2D-carrier profiles from high resolution scanning spreading resistance microscopy into a device simulator. We demonstrate the incorporation of the quantified SSRM 2D-profiles into a device simulator using data collected on p-MOSFETs. Based on these profiles the simulator now predicts the electrical characteristics of the device in excellent agreement with the experimental device results, whereas calculations based on (advanced calibration) process simulations showed significant discrepancies. With this approach the difficult and time consuming calibration step of the process simulation can be circumvented and device results can be interpreted directly based on the details of the real 2D-carrier profiles.
机译:我们开发了一种程序和软件,通过将高分辨率扫描扩展电阻显微镜中的2D载流子剖面图合并到设备模拟器中,可以预测和了解设备性能。我们演示了使用在p-MOSFET上收集的数据将量化的SSRM 2D轮廓合并到设备模拟器中。现在,基于这些配置文件,仿真器可以预测设备的电气特性,与实验设备的结果非常吻合,而基于(高级校准)过程仿真的计算则显示出明显的差异。通过这种方法,可以避免过程模拟中困难且耗时的校准步骤,并且可以基于真实2D载波配置文件的详细信息直接解释设备结果。

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