Strength and Reliability Estimation of a Low Temperature Co-Fired Ceramic (LTCC) With and Without Metallic Features

摘要

The use of Low Temperature Co-Fired Ceramics (LTCC) is a very attractive material option for advancedpackaging. For applications, a variety of features are printed in the base material: thermal and electrical vias,resistors, solder pads to name a few. Most of these features have materials that are thermally and elasticallymismatched from the LTCC, producing a localized residual stress. These stresses impact the strength and reliabilityof the LTCC package. Here we present results and analysis for the strength and reliability assessment of an LTCC(Dupont? 951) with and without Au vias. The reliability of the ceramic material is assessed from the perspective ofits susceptibility to sub-critical crack growth (SCG). Metallic vias can significantly lower the strength of the LTCC,however, their presence does not change the measured susceptibility of the material to SCG. Using our experimentaldata, and empirical descriptions of SCG laws, safe design life for LTCC packages under a particular stress state isestimated.