Why Wedge Bond?

摘要

Wedge bonding has the potential to emerge as a driving technology for bondingfine-pitch devices. The deformation (width) of a full strength wedge bond is typically 33%smaller than the smallest diameter ball bond of the same wire diameter. As we move tofiner pad pitches which necessitates smaller bond pads (as predicted by the ITRSRoadmap) the diameter of smaller diameter bonding wire presents a roadblock. Smallerdiameter wire has significantly lower conductivity (current carrying capacity). Wedgebonding allows use of a larger wire diameter than ball bonding for the same pad sizeproviding higher current for the package.New looping capabilities, higher bonding speed (productivity) and qualityassurance tools (Process Integrated Quality Control?) provide high-reliabilityinterconnection solutions for advanced military, aerospace, medical and optoelectronicpackages.