Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects

摘要

In this paper, a Wafer Level Packaging (WLP) compatible pressure sensor system enabled with Through SiliconVia (TSV) and Au-Sn inter-chip micro-bump bonding is designed and fabricated in lab, in which TSV transmitselectrical signal from piezoresistive circuit to processing circuit vertically.The pressure sensor system includes TSV integrated piezoresistive pressure sensor chip and Read-OutIntegrated Chip (ROIC) in which TSV also incorporated. Two CMOS compatible fabrication process flows forpressure sensor system are demonstrated. And, flip chip bonding structure of TSV integrated pressure sensorwith a ROIC are realized using one of these two process flows. Inter-chip interconnects enabled with TSV andmicro-bump bonding is obtained.