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High temperature physical modeling and verification of 4H-SiC lateral JFET device

机译:4H-SiC横向JFET器件的高温物理建模和验证

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Silicon Carbide (SiC) lateral JFET (LJFET) has drawn significant attentions due to its excellent performance in high-temperature and high-frequency electronics applications. This paper establishes a comprehensive physical model, including both DC and AC characteristics, for 4H-SiC lateral JFET at room temperature and high temperature (300°C). Finite element numerical simulation and experimental measurement are carried out to verify the validity of the established physical model. Good agreements have been achieved among these three sets of results. For the first time, the modeling work studied the detailed operating mechanism and provided valuable design guidelines for SiC LJFET device at temperature as high as 300°C.
机译:碳化硅(SiC)横向JFET(LJFET)由于其在高温和高频电子应用中的出色性能而备受关注。本文针对室温和高温(300°C)下的4H-SiC横向JFET建立了包括DC和AC特性在内的综合物理模型。进行了有限元数值模拟和实验测量,以验证所建立物理模型的有效性。在这三组结果之间已经达成了良好的协议。建模工作首次研究了详细的工作机制,并为高达300°C的SiC LJFET器件提供了有价值的设计指南。

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