With the technology advancing, most products are getting more personalize with various variety. Hand held products that are larger than palm size has no longer favor one's interest; the miniature product is the future, its means smaller, lighter and portable. Miniaturization product can be succeeded by reducing package size and the integration of ultra-small component (0402, 0201, 01005). SIP-MCM (system in package-multichip module) is one of the technologies that involve; this package is built with the combination of multiple dies and miniature passive components in SMT processes. In SMT process, small chip components prone to have tombstone defect
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