首页> 外文会议>Conference on Photomask Technology; 20070918-21; Monterey,CA(US) >Sensitivity comparison of Fast Integrated Die-to-Die T+R pattern inspection, standard database inspection and STAR light2~TM contamination mode for application in mask production
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Sensitivity comparison of Fast Integrated Die-to-Die T+R pattern inspection, standard database inspection and STAR light2~TM contamination mode for application in mask production

机译:快速集成芯片对芯片T + R图案检查,标准数据库检查和STAR light2〜TM污染模式在掩模生产中的灵敏度比较

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'Fast Integrated Die-to-Die T+R' pattern inspection (DDTR), reflected tritone database inspection (DBRt) and STARlight2~TM (SL2) contamination inspection are employed by mask makers in order to detect pattern defects and contamination defects on photomasks for in process inspection steps. In this paper we compare the detection capabilities of these modes on real production masks with a representative set of contamination and pattern defects. Currently, SL2 inspection is used to find contamination defects and die-to-die and die-to-database are used for pattern defects. In this paper we will show that the new introduced 'Fast Integrated Die-to-Die T+R' pattern inspection (DDTR) in combination with the DBRt can be used in production environment, instead of SL2 without any loss in the sensitivity. During the study, we collected and analyzed inspection data on critical layers such as lines & spaces and contact holes. Besides, performance of the modes on product plates characterization was done using a test mask with programmed defects.
机译:掩模制造商采用了“快速集成的芯片对芯片T + R”图案检查(DDTR),反射三色调数据库检查(DBRt)和STARlight2〜TM(SL2)污染检查,以检测光掩模上的图案缺陷和污染缺陷用于过程中的检查步骤。在本文中,我们将这些模式在实际生产掩模上的检测能力与一组代表性的污染和图案缺陷进行了比较。目前,SL2检查用于发现污染缺陷,而芯片对芯片和芯片对数据库则用于图案缺陷。在本文中,我们将证明与DBRt结合使用的新推出的“快速集成管芯到管芯T + R”图案检查(DDTR)可以在生产环境中使用,而不是SL2,而不会降低灵敏度。在研究过程中,我们收集并分析了关键层(例如线和空间以及接触孔)上的检查数据。此外,使用具有编程缺陷的测试掩膜来完成产品板上的模式表征。

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