Void Elimination Research in Bottom Anti-Reflective Coatings for Dual Damascene Photolithography

摘要

This paper describes the research completed to qualify materials to be used as bottom anti-reflective coatings (BARCs) for dual damascene (DD) photolithography. Several problems have been identified in the DD process. Among them are low fill, iso-dense bias, meniscus shape, via wall coating, and void formation. The issue focused upon in this research is incomplete displacement or void formation in the vias. These voids will have detrimental effects and could ultimately cause chip failure.