The mechanical and environmental properties and ultimate reliability of any encapsulated semiconductor package depend greatly on the liquid encapsulation material (liquid molding compound) used and the process by which it is applied. The body of data extolling the virtues of properly applied encapsulants covers the full range of package configurations, including direct chip attach (DCA), chip-scale-package (CSP), and cavity packages such as the ball grid array (BGA). The proper method of applying or dispensing encapsulants, or in other words the 'best dispensing practices', depends on the effects of temperature as one of several importyant factors.
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