New innovations in dispensing liquid encapsulants

摘要

Wire-bonded semiconductor integrated circuits (ICs) are ultimately packaged by encapsulation, typically using transfer molding. Because of sheer volume — tens of billions of ICs produced each year—molding is the process of choice because it is the most cost-effective method for certain types of packages. However, liquid encapsulants are gaining acceptance for use in encapsulating advanced IC packages on rigid and flexible organic substrates. These applications include dam-and-fill applications in ball grid array (BGA), chip scale and chip array packages.