Resin composition for liquid encapsulant and liquid encapsulant

摘要

The present invention provides: a resin composition for use in a liquid sealant, which is composed mainly of an epoxy compound and a polycarbodiimide resin, the proportion of the polycarbodiimide resin being 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, and which is liquid or fluid at ordinary temperature; and a liquid sealant comprising: a resin composition which is composed mainly of an epoxy compound and a polycarbodiimide resin, the proportion of the polycarbodiimide resin being 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, an epoxy resin curing agent, an epoxy resin curing accelerator, and an inorganic powder, which liquid sealant is liquid or fluid at ordinary temperature.