Wedge Bonding RF and Microwave Devices

摘要

Interconnecting RF and Microwave devices requires demanding capabilities that can only be provided by wedge bonding. Flat, extremely low loop shape, constant wire length and ribbon bonding are all normal capabilities of wedge bonders that cannot be produced by ball bonders. The flexibility and design of wedge bonding equipment enables all of these capabilities by designing the wire clamp so that both round and ribbon wire can be easily interchanged on the same bond head with only minor adjustments. The shape and functionality of the wedge, feeding the wire from behind and under the face of the tool, naturally produces lower height loops than ball bonders. Enhanced software assists the process by making the programming of low stress-free loops user friendly.