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Segregation of Gold At dislocations conirmed by GOLD Diffusion into highly dislocated Silicon

机译:在金扩散导致高位错的硅错位时金的偏析

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We report on Au-diffusion experiments performed between 850 degree and 1100 degree into plasticaly deformed si monocyrstals, undoped and uniformly doped with a B ocncentration of 3*10 sup 19 cm sup -3. After indiffusion, Au profiles were monitored with neutron activation analysis in conjunction with mechanical sectioning. The profiles show Au-difusion to be faster in heavily B-doped SI than in undoped samples. Fittingof the experimental proiles which are accurately desicribed with ocmpelmentary error functions yields an effective diffusion cefficient and a boundary ocncentration C sub au(x=0). The segregatio of Au at dislocations is found to increase with devreasing temperature with an activation enthalpy of about -1.9eV. From the influence of doping obsrved on AU diffusion into dislocated Si, we deduce that interstitial Au is positively charged in p-type Si and introduces a fonor level at about 0.47eV above the valence-band edge.
机译:我们报告了在850度至1100度之间对可塑性变形的si单晶壳进行的Au扩散实验,未掺杂和均匀掺杂的B浓度为3 * 10 sup 19 cm sup -3。注入后,通过中子活化分析结合机械切片监测金的分布。剖面图表明,在重掺杂B的SI中,Au扩散比未掺杂的样品中的Au扩散更快。拟合了用微积分误差函数精确干燥的实验质子,可以产生有效的扩散系数和边界浓度C sub au(x = 0)。发现位错处的Au的偏析随着温度的升高而增加,具有约-1.9eV的活化焓。从掺杂的杂质对AU扩散到位错Si中的影响,我们推论间隙性Au在p型Si中带正电,并在价带边缘上方约0.47eV处引入fonor能级。

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