The effects of new trends in flip chip packages on automating the underfill processes

摘要

Underfill packages are constantly changing to meet the needs of cost, reliability, and package size as flip chips are finding their way into new and expanded markets. These trends affect the package, underfill fluids, and substrate materials. Key variables and specifications for automating the underfill process are outlined. Methods of reducing cost, improving performance, and increasing speed are given. Hardware and software features that enhance speed, reliability, or reduce production cost are also evaluated. The technologies available for heat control, handling of parts, dispensing fluids, and statistical process control (SPC) during production are discussed in light of the various trends in flip chip packages. Case studies with SPC data for various performance criteria are given as examples for the above discussion.