Precision grinding (1) is accomplished by the cutting action of many sharp diamonds embedded in the wheel binder material. The fracture damage in the resulting part is dependent on the material properties and operating conditions. Considering grinding as a multi-scratch process, the response of a single cutting grain and the damage transitions produced by the cutting action as the load on the grain is varied, will be of primary interest. The microcutting action of a single cutter is important because it plays a key role in determining the subsurface fracture damage produced in processes such as polishing and grinding (1,2). In recent studies with glass and amorphous SiC thin films, Tanikella and Scattergood (3,4,5) demonstrated a one-to-one correspondence between crack-initiation and depth-of-cut during microcutting. Extension of the results using statistical averaging effects will facilitate the prediction of the surface finish and subsurface fracture damage. The effect of crystallography is important for developing these models for crystalline materials. The purpose of the present work is to investigate hte cracking thresholds, crystallography, and tool geometry effects for single crystal silicon. An understanding of the micromechanics of silicon would also enhance its utility as a high-precision, high-strenght, high-reliability mechanical material, especially applicable in micro mechanical devices and components in conjunction with integrated electronics.
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