Electrical Performances of a Mounted Chip in a Plastic Package

摘要

An electrical modelling concept for high speed packages (f≪5 GHz) is proposed. Using an equivalent circuit of an assembled SO8 package, electrical performances are simulated. It is shown that the inductive path between the gound plane of the die and the main ground plane constitute a severe limitation at high frequency. Our modelling concept is applicable to any single chip package.